Diamond wire, diamond cutting wire
The diamond cutting wire is a new product developed through our unique research and development. The quality of the product has reached a world-leading level.
The product is used for cutting with a power supply that supports the instruction manual in a multi-wire cutting machine line, which can replace the optical polishing processing process. It is for precision cutting of artificial crystals, ceramics, quartz glass, single crystal silicon, polycrystalline silicon, sapphire, and special metal materials. Technical parameters: 1. Diameter: 0.12 to 0.36 millimeters, with a diameter deviation of ≤0.01 millimeters. 2. Base material: cutting of high-tensile steel wire. 3. Size of diamond abrasives: from below 5μm to 60μm, we can design according to customer requirements. 4. Tensile strength: 3200 to 3400 MPa. 5. Wire length: we can process according to user requirements.
- Company：LASER STAR CO., LTD.(レーザースター沛星光電有限公司)
- Price：Other
